HBM is a next-generation memory technology that achieves ultra-high speed and bandwidth by vertically stacking dies based on TSV (Through Silicon Via).

Package technology is a process technology that connects semiconductor chips to substrates, lead frames, modules, and other components, enabling the exchange of electrical signals with external devices.

MI technology is a solution that integrates and manages processes, equipment, logistics, and data across semiconductor production lines. Integrated with MES, FMS, and automated equipment, it enables production efficiency, quality stability, and real-time monitoring.

As the final quality assurance stage before shipment, testing technology verifies the electrical characteristics, functionality, and reliability of finished semiconductor products.

We support part damage prevention, extended service life, and quality stabilization through cleaning, inspection, and maintenance in our specialized in-house workspace.