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컨텐츠 내용시작

In-house Work

JIG & Magazine

JIG & Magazine

Process Introduction

A JIG is a precision fixture used to securely hold and align semiconductor products and substrates, maintaining stable positioning and geometry during Bonding and assembly processes. A Magazine serves as a carrier that organizes, stores, and transports JIGs and products by LOT, while interfacing with automated equipment.

Work Information
Work Introduction

If Flux, metal particles, Dust, or residual solvents accumulate on the JIG and Magazine, or if their surfaces become deformed, issues such as Pin Hole blockage, Barcode/RFID recognition failures, alignment errors, and poor contact may occur. Contaminants are removed through ultrasonic cleaning and Air Gun cleaning, while warpage, Scratches, Coating, Slot conditions, LOT-based S/N arrangement, and packaging conditions are inspected. This process helps maintain fixture precision and product traceability, improving Bonding quality and shipping reliability.

Work Details
  • Inspect the Bath, Heater, and output condition of the ultrasonic cleaner, then clean using a dedicated cleaning solution and DIW.
  • Use an Air Gun to remove residual contaminants from Pin Holes, 2D Barcodes, and surfaces.
  • Inspect the TOP and Bottom JIGs for warpage, Scratches, and Coating condition, and check the Magazine Slots and RFID condition.
  • Perform detailed inspections for Particles, metal debris, and adhered contaminants using a magnifying glass and electron microscope.
  • Verify S/N arrangement by LOT and packaging conditions to maintain shipping quality.
  • Separate and dispose of waste liquid and contaminants according to specified standards, and clean the work area.
Work Results
  • Maintain JIG alignment accuracy to improve Bonding quality and product yield.
  • Prevent Open/Short defects and poor contact caused by Particles and metal debris.
  • Maintain stable Barcode and RFID recognition to ensure LOT traceability.
  • Detect surface damage and deformation at an early stage to extend JIG lifespan and reduce Downtime.
  • Prevent recontamination during packaging and shipping to improve quality reliability.