Business
컨텐츠 내용시작
HBM
BLADE
Process Introduction
The Blade Dicing process involves cutting a processed wafer into individual semiconductor chips. A high-precision diamond-embedded blade rotates at high speed to precisely cut and separate the wafer, enabling individual chips to be handled and used in subsequent processes.
Work Information
Work Introduction
Cutting precision and Blade condition are critical factors that determine product quality in the Blade Dicing process. Blade wear, Chuck Table contamination, or abnormalities in cutting water supply may cause quality issues such as chip damage, Chipping, and Burrs. The Manufacturing Engineering Team maintains stable cutting quality and equipment performance through preventive maintenance.
Work Details
- Perform internal equipment cleaning to prevent the accumulation of cutting debris and particles.
- Inspect the Blade condition and replace it according to wear criteria.
- Perform Blade Sawing Calibration to maintain accurate cutting position and depth.
- Perform Manual Dressing to maintain optimal Blade cutting performance.
- Inspect the DI Water Nozzle to ensure proper cooling and cleaning performance during cutting.
- Clean the Chuck Table and manage its flatness to ensure stable wafer fixation.
- Regularly replace key raw materials and consumable parts.
- Check Machine Parameters to maintain standard process conditions.
Work Results
- Improve cutting precision to minimize chip damage and Chipping.
- Maintain consistent wafer cutting quality to improve production yield.
- Prevent quality issues caused by particles and cutting debris.
- Minimize production losses caused by equipment performance degradation.
- Establish a stable quality foundation for subsequent processes.