The CoW process is a high-precision bonding process that requires micrometer-level alignment and precise control of pressure and temperature. Stage misalignment, changes in Tool Tilt, or degraded Heater performance may result in bump bonding defects and reduced product reliability. The Manufacturing Engineering Team maintains equipment precision and process stability through preventive maintenance, ensuring consistent and reliable bonding quality.

• Inspect the positional accuracy and repeatability of the Bonding Stage to maintain stable chip alignment.
• Manage the flatness and alignment of the Panels (L/R) to minimize variations in bonding quality.
• Inspect the Tool Tilt to maintain uniform contact between the chip and wafer.
• Check the performance of the Tool Head Heater to maintain stable temperature conditions.
• Manage and periodically replace the Foil to ensure consistent process quality.
• Manage Foil rotation settings and product changeover conditions to maintain optimal process conditions for each product.
• Perform internal equipment cleaning to prevent particle generation and contamination.
• Inspect the Cartridge Permatork condition to support stable process operation.

• Improve bonding accuracy between the chip and wafer to maintain stable bonding quality.
• Minimize bump bonding failures and misalignment defects.
• Reduce quality variation between products to improve process reliability.
• Prevent production losses caused by equipment failures and improve equipment uptime.
• Contribute to ensuring the electrical performance and long-term reliability of HBM packages.