Business
컨텐츠 내용시작
HBM
CBM
Process Introduction
The CBM process is a surface activation process that applies plasma treatment to the wafer surface to remove organic contaminants, oxide layers, and residual resin. It is a critical pre-treatment process that improves adhesion strength and reliability in subsequent bonding, coating, and wire bonding processes.
Work Information
Work Introduction
Plasma treatment quality is significantly affected by the condition of internal chamber components and exhaust performance. The accumulation of process by-products can reduce plasma uniformity and surface activation effectiveness, potentially leading to reduced adhesion strength and quality issues. The Manufacturing Engineering Team maintains an optimal plasma treatment environment through preventive maintenance.
Work Details
- Inspect the Focus Adaptor to maintain uniform plasma treatment conditions.
- Manage the condition of the Shadow Frame to ensure stable product positioning.
- Inspect and replace the Wall Liner to prevent contamination buildup inside the chamber.
- Manage the Baffle to maintain stable plasma flow and exhaust performance.
- Inspect the Ceramic Ring for wear and contamination to ensure process stability.
- Inspect the Exhaust System to maintain efficient exhaust performance.
- Perform internal equipment cleaning to maintain chamber cleanliness.
Work Results
- Improve plasma treatment uniformity to maintain consistent surface activation quality.
- Improve adhesion and coating performance to ensure quality in subsequent processes.
- Maximize the removal of organic contaminants and oxide layers.
- Minimize delamination and bonding defects.
- Contribute to improving the long-term reliability of HBM packages.