Business
컨텐츠 내용시작
HBM
EXPAND UV
Process Introduction
The Expand UV process increases the spacing between individual chips after Blade Sawing and adjusts the adhesion strength of the dicing tape through UV irradiation. It is an important preparation step that enables stable separation of individual chips during the subsequent Pick-Up process.
Work Information
Work Introduction
If uniformity is not maintained during the Expand process, variations in chip spacing may occur, potentially causing Pick-Up defects and chip damage. In addition, particle generation can directly affect product quality. Therefore, preventive maintenance is performed to maintain stable equipment conditions and a clean process environment.
Work Details
- Clean the Chuck Table to maintain stable product fixation.
- Perform internal equipment cleaning to minimize particle generation.
- Inspect equipment conditions to maintain uniform Expand performance.
Work Results
- Minimize chip damage and Pick-Up defects.
- Prevent quality issues caused by particles.
- Improve productivity in subsequent processes.
- Contribute to ensuring stable and consistent process quality.