Business
컨텐츠 내용시작
HBM
LAMI
Process Introduction
The lamination process involves precisely applying a protective or functional film to the wafer surface. Heat and pressure are applied to ensure uniform adhesion without air bubbles. NCF (Non-Conductive Film), in particular, serves as a key material that provides insulation and adhesion prior to the stacking process.
Work Information
Work Introduction
Film application uniformity and cleanliness directly affect product quality in the lamination process. Uneven film tension, dust contamination, or cutter wear may cause air bubbles, film wrinkles, and adhesion defects. The Manufacturing Engineering Team maintains stable film application quality through preventive maintenance.
Work Details
- Perform internal equipment cleaning to minimize foreign matter and particle generation.
- Manage the condition of the Lamination Tape to maintain stable film supply conditions.
- Inspect the NCF loading condition and supply system to ensure consistent film quality.
- Manage the Dust Box to maintain cleanliness inside the equipment.
- Inspect and replace the Cutter to maintain stable film cutting quality.
- Inspect the Ring Frame to ensure stable wafer fixation.
- Clean the Chuck Table and maintain its flatness.
- Regularly inspect and replace raw materials and consumable parts.
- Check Machine Parameters to maintain optimal process conditions.
Work Results
- Minimize Air Bubbles and film adhesion defects.
- Improve wafer protection performance and reliability in subsequent processes.
- Maintain stable NCF adhesion quality, contributing to improved stacking quality.
- Prevent quality defects caused by particles.
- Improve process stability and production yield.