Business
컨텐츠 내용시작
Package Technology
[Process Equipment]
Die Attach
Process Introduction
The Die Attach process precisely attaches semiconductor chips to a substrate or lead frame. As a key stage in semiconductor package assembly, it plays an important role in ensuring product performance and reliability.
Work Information
Work Introduction
The Die Attach process requires high precision in chip alignment and adhesive dispensing. Nozzle contamination, alignment errors, or abnormalities in the adhesive supply may lead to degraded product quality. Therefore, regular preventive maintenance is performed to maintain stable equipment performance and process accuracy.
Work Details
- Inspect the Pick-Up Nozzle and Bonding Head to maintain stable chip transfer.
- Inspect the adhesive supply system to ensure consistent dispensing quality.
- Inspect the Vision System and alignment system to maintain positional accuracy.
- Inspect the drive and transfer components for wear and perform lubrication as required.
- Remove foreign materials and particles from inside the equipment to maintain a clean operating environment.
- Inspect the operating condition of key Sensors and control systems.
Work Results
- Improve Die Attach accuracy to maintain consistent product quality.
- Minimize bonding defects and positional errors.
- Improve package reliability and product lifetime.
- Prevent production losses caused by equipment malfunctions.
- Contribute to improving production yield and process stability.