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컨텐츠 내용시작

Package Technology

SMT
[Process Equipment]

SMT

Process Introduction

The SMT (Surface Mount Technology) process is an automated process for mounting electronic components onto the surface of a PCB. It is a key production process that builds electronic circuits by placing various components with high speed and precision.

Work Information
Work Introduction

Since SMT equipment repeatedly places a large number of electronic components at high speed, the condition of the Nozzles, Sensors, drive components, and alignment systems directly affects production quality. Reduced equipment precision may result in component positioning errors, Pick-Up failures, and placement defects. Therefore, regular preventive maintenance is performed to maintain optimal equipment condition and stable production quality.

Work Details
  • Inspect the Screen Printer Mask and Wiper to maintain consistent Solder Paste printing quality.
  • Manage Mounter Nozzle cleanliness and suction performance to ensure placement accuracy.
  • Maintain proper lubrication of the LM Guides and Ball Screws to ensure stable drive performance.
  • Inspect the Vision System and Sensors to ensure accurate component recognition.
  • Remove particles and foreign materials from inside the equipment to maintain a clean production environment.
  • Inspect key drive components and control systems to prevent equipment malfunctions.
Work Results
  • Improve component placement accuracy to maintain consistent product quality.
  • Reduce Pick-Up failures and placement errors to improve production yield.
  • Minimize quality variations during repetitive production.
  • Prevent production downtime caused by drive component wear and Sensor malfunctions.
  • Improve equipment reliability and productivity to establish a stable mass production system.