Business
컨텐츠 내용시작
Package Technology
[Back-End Process Equipment]
Saw & Sorter
Process Introduction
The Saw & Sorter process cuts a wafer into individual chips and then automatically sorts and classifies them. It plays an important role in ensuring semiconductor chip quality and improving the efficiency of subsequent processes.
Work Information
Work Introduction
During the wafer cutting process, fine particles and cutting by-products are generated, while cutting precision and sorting accuracy directly affect product quality. The Manufacturing Engineering Team maintains equipment cleanliness and processing precision through preventive maintenance, ensuring a stable production environment.
Work Details
- Inspect the cutting Blade for wear and replace it as necessary to maintain cutting quality.
- Inspect the dust collection and particle removal systems to maintain cleanliness inside the equipment.
- Check the operating condition of the product transfer and sorting systems.
- Verify the accuracy of Sensors and inspection devices to maintain sorting quality.
- Remove contaminants and foreign materials from inside the equipment to support stable operation.
- Inspect key drive components and control systems for any abnormalities.
Work Results
- Minimize chip damage and cutting defects.
- Improve quality reliability through accurate product sorting.
- Maintain consistent product quality by reducing particle contamination.
- Reduce the risk of equipment failures and production downtime.
- Contribute to improving production efficiency and product yield.