If Flux, Solder, Dust, or fine contaminants remain on PCBs and fixtures, or if Magazines and Squeegees become deformed, defects such as poor bonding, degraded electrical performance, printing defects, and material transfer errors may occur. Each material is cleaned and dried using dedicated Tools and cleaning equipment, followed by Air Blow, precision visual inspection, and automated inspection to check for residual contaminants, blockages, warpage, and damage. This process helps maintain cleanliness and fixture precision in the module assembly process, ensuring stable bonding quality and product reliability.

• Clean key materials and fixtures, including PCBs, Stencils, Squeegees, and Magazines.
• Remove Flux, Solder residue, and fine particles to maintain cleanliness.
• Inspect and remove residual contaminants from PCB surfaces and Pattern areas.
• Check Stencil apertures for blockages and residual Solder Paste, and clean them thoroughly.
• Inspect the Squeegee for warpage, blade condition, and surface damage.
• Check the Magazine Slots, exterior condition, and RFID to maintain stable material transfer.
• Classify and manage acceptable and defective items based on inspection results.

• Prevent bonding defects and degraded electrical performance caused by residual Flux, Solder, and particles.
• Maintain PCB cleanliness and Stencil aperture condition to improve printing and component placement quality.
• Manage Squeegee warpage and blade condition to ensure uniform Solder Paste application.
• Maintain Magazine Slot and RFID conditions to ensure stable material transfer and traceability.
• Prevent defective products from escaping detection through precision inspection and digital history management, improving the quality reliability of module products.