If EMC residue and cleaning agents accumulate inside the mold, or if the condition of the Cavity Holes, Location Pins, Eject Pins, or Vacuum Seals deteriorates, defects such as incomplete molding, Voids, Resin Bleed, surface marks, and Vacuum failures may occur. Mold cleaning is performed using Melamine and Wax Sheets, along with precision cleaning of the Cavity and Pin areas, inspection and replacement of Vacuum Seals, and molding verification using Dummy products. This process helps maintain mold precision and Vacuum performance, prevent molding defects, and ensure consistent packaging quality.

• Remove accumulated EMC residue and contaminants from inside the mold to maintain cleanliness.
• Inspect and thoroughly clean key areas such as the Cavity, Location Pins, and Eject Pins.
• Remove adhered residues from the mold surfaces, edges, and Hole areas.
• Inspect the Vacuum Seals and Vacuum condition to ensure stable molding conditions.
• Inspect consumable components for wear or performance degradation and replace them as necessary.
• Perform Dummy molding to verify filling conditions and appearance quality.
• After maintenance, conduct a final inspection of the mold condition and equipment operation.

• Prevent incomplete molding, Voids, and appearance defects caused by mold contamination and EMC residue.
• Maintain the precision of Cavity and Pin areas to improve molding quality and product yield.
• Manage Vacuum Seals and Vacuum performance to minimize molding variations and equipment alarms.
• Detect mold damage and abnormal wear at an early stage to extend mold service life.
• Verify process stability and product quality reliability before mass production through Dummy molding.