Business
컨텐츠 내용시작
Package Technology
[Cleaning & Packaging Equipment]
Plasma
Process Introduction
The Plasma process uses plasma treatment to remove organic materials and contaminants from semiconductor surfaces and activate the surface. It is an important surface treatment process that improves adhesion and reliability in subsequent bonding and packaging processes.
Work Information
Work Introduction
Due to the nature of the Plasma process, contaminants and process by-products may accumulate inside the chamber, while vacuum conditions and plasma generation parameters directly affect process quality. Unstable equipment conditions may result in reduced surface treatment uniformity and adhesion defects. Therefore, regular preventive maintenance is performed to maintain a stable and reliable process environment.
Work Details
- Remove contaminants and process by-products from inside the chamber to maintain a clean process environment.
- Inspect the vacuum conditions and exhaust system to ensure stable plasma generation conditions.
- Inspect the electrodes and plasma generation components to maintain process uniformity.
- Check the Sensors and control systems to support stable equipment operation.
- Inspect key components for wear and replace them as necessary.
- Remove particles and contaminants from inside the equipment to prevent product contamination.
Work Results
- Improve plasma treatment uniformity to maintain stable bonding quality.
- Enhance surface activation performance to improve adhesion and bonding strength.
- Prevent process defects and delamination caused by contamination.
- Improve production efficiency by enhancing equipment stability.
- Contribute to improving semiconductor package reliability and quality.