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Package Technology
Chiller Expender
Process Introduction
The Chiller Expander is equipment designed to uniformly expand the tape of a diced wafer, creating sufficient spacing between individual Dies. It prevents interference between chips and supports stable operation of the subsequent Pick-Up and Bonding processes.
Work Information
If tape residue, Die fragments, and particles accumulate inside the Chiller Expander, they may cause reduced Vacuum performance, Sensor malfunctions, uneven Expansion, and Pick-Up defects. After safely placing the equipment port in a non-operating state, internal particles and adhesive residues are removed, and key contact areas are cleaned. This process helps maintain uniform Tape expansion and stable equipment operation, improving the quality of subsequent transfer and Bonding processes.
- Set the equipment Port to a non-operating state to prevent material loading during maintenance.
- Remove Die fragments and particles from inside the equipment using a vacuum cleaner.
- Clean internal contact areas and key components using DI Wipers and Dry Wipers.
- Remove unnecessary stickers and adhesive residues from inside the equipment.
- Verify the internal and external cleanliness, restore the Port to its normal operating state, and confirm proper equipment operation.
- Maintain stable Vacuum performance and uniform Tape Expansion.
- Minimize Die Cracks and Pick-Up defects.
- Prevent equipment malfunctions caused by Sensor contamination and particles.
- Improve the stability of subsequent transfer and Bonding processes, contributing to enhanced product quality and yield.