Business
컨텐츠 내용시작
Package Technology
[Process Equipment]
Underfill
Process Introduction
The Underfill process injects resin into the microscopic gaps between a semiconductor chip and substrate to protect the product from external impact and thermal stress. It is an important semiconductor back-end process that improves package reliability and durability.
Work Information
Work Introduction
The key to the Underfill process is to precisely dispense a controlled amount of resin and ensure uniform filling. Nozzle contamination or the buildup of cured resin may cause dispensing volume variations and filling defects, which can reduce product reliability. The Manufacturing Engineering Team continuously maintains the equipment to ensure stable and consistent resin filling quality.
Work Details
- Inspect the resin supply lines and Nozzle interior to maintain stable dispensing performance.
- Remove residual and cured resin from inside the equipment to prevent contamination.
- Check the dispensing volume and position of the dispensing system to maintain precision.
- Inspect the Sensors and drive components to ensure stable equipment operation.
- Inspect key components for wear and replace them as necessary to prevent performance degradation.
- Maintain cleanliness inside the equipment to prevent product contamination.
Work Results
- Improve resin filling quality to ensure package reliability.
- Reduce Voids and incomplete filling defects to improve overall quality.
- Prevent equipment malfunctions caused by resin contamination and cured resin buildup.
- Maintain stable process conditions to improve production yield.
- Improve equipment operational stability and production efficiency.